JPS5332381A - Insulating plate - Google Patents
Insulating plateInfo
- Publication number
- JPS5332381A JPS5332381A JP10698576A JP10698576A JPS5332381A JP S5332381 A JPS5332381 A JP S5332381A JP 10698576 A JP10698576 A JP 10698576A JP 10698576 A JP10698576 A JP 10698576A JP S5332381 A JPS5332381 A JP S5332381A
- Authority
- JP
- Japan
- Prior art keywords
- insulating plate
- insulating
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10698576A JPS5332381A (en) | 1976-09-06 | 1976-09-06 | Insulating plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10698576A JPS5332381A (en) | 1976-09-06 | 1976-09-06 | Insulating plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5332381A true JPS5332381A (en) | 1978-03-27 |
Family
ID=14447543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10698576A Pending JPS5332381A (en) | 1976-09-06 | 1976-09-06 | Insulating plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5332381A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5788793A (en) * | 1980-09-22 | 1982-06-02 | Siemens Ag | Heat dissipating type printed circuit board |
JPH01148321U (en) * | 1989-03-15 | 1989-10-13 | ||
JP2006196483A (en) * | 2005-01-11 | 2006-07-27 | Dainippon Printing Co Ltd | Wiring board and its manufacturing method |
JP2012104794A (en) * | 2010-11-05 | 2012-05-31 | Samsung Electro-Mechanics Co Ltd | Heat dissipation substrate and manufacturing method for the same |
-
1976
- 1976-09-06 JP JP10698576A patent/JPS5332381A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5788793A (en) * | 1980-09-22 | 1982-06-02 | Siemens Ag | Heat dissipating type printed circuit board |
JPH046115B2 (en) * | 1980-09-22 | 1992-02-04 | Siemens Ag | |
JPH01148321U (en) * | 1989-03-15 | 1989-10-13 | ||
JPH0445865Y2 (en) * | 1989-03-15 | 1992-10-28 | ||
JP2006196483A (en) * | 2005-01-11 | 2006-07-27 | Dainippon Printing Co Ltd | Wiring board and its manufacturing method |
JP2012104794A (en) * | 2010-11-05 | 2012-05-31 | Samsung Electro-Mechanics Co Ltd | Heat dissipation substrate and manufacturing method for the same |
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