JPS5330477A - Preparation of liquid drop - Google Patents

Preparation of liquid drop

Info

Publication number
JPS5330477A
JPS5330477A JP10522776A JP10522776A JPS5330477A JP S5330477 A JPS5330477 A JP S5330477A JP 10522776 A JP10522776 A JP 10522776A JP 10522776 A JP10522776 A JP 10522776A JP S5330477 A JPS5330477 A JP S5330477A
Authority
JP
Japan
Prior art keywords
liquid drop
cylinder
preparation
covering matter
netlike
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10522776A
Other languages
Japanese (ja)
Other versions
JPS553007B2 (en
Inventor
Kinjiro Fujii
Akihiro Motoe
Kensuke Umemura
Toshiaki Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology, Mitsui Mining and Smelting Co Ltd filed Critical Agency of Industrial Science and Technology
Priority to JP10522776A priority Critical patent/JPS5330477A/en
Publication of JPS5330477A publication Critical patent/JPS5330477A/en
Publication of JPS553007B2 publication Critical patent/JPS553007B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Nozzles (AREA)
  • Glanulating (AREA)
  • Preparation Of Clay, And Manufacture Of Mixtures Containing Clay Or Cement (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

PURPOSE: To make the liquid drop, having various size, by making covering matter, composed of solution, sludge etc., on the surface of netlike etc. cylinder, rotating around nearly horizontal shaft and blowing upon gas from the inner part of the cylinder and then, breaking off the above covering matter from the surface of the cylinder.
COPYRIGHT: (C)1978,JPO&Japio
JP10522776A 1976-09-02 1976-09-02 Preparation of liquid drop Granted JPS5330477A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10522776A JPS5330477A (en) 1976-09-02 1976-09-02 Preparation of liquid drop

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10522776A JPS5330477A (en) 1976-09-02 1976-09-02 Preparation of liquid drop

Publications (2)

Publication Number Publication Date
JPS5330477A true JPS5330477A (en) 1978-03-22
JPS553007B2 JPS553007B2 (en) 1980-01-23

Family

ID=14401768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10522776A Granted JPS5330477A (en) 1976-09-02 1976-09-02 Preparation of liquid drop

Country Status (1)

Country Link
JP (1) JPS5330477A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6149435A (en) * 1984-08-17 1986-03-11 Matsushita Electronics Corp Semiconductor device
JPS61242033A (en) * 1985-04-19 1986-10-28 Nippon Telegr & Teleph Corp <Ntt> Bonding process of semiconductor substrate
JPS61292934A (en) * 1985-06-21 1986-12-23 Toshiba Corp Manufacture of semiconductor element
JPS62177938A (en) * 1986-01-31 1987-08-04 Nippon Telegr & Teleph Corp <Ntt> Manufacture of composite substrate with mutually separated island region consisting of plurality of material on same plane

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6149435A (en) * 1984-08-17 1986-03-11 Matsushita Electronics Corp Semiconductor device
JPS61242033A (en) * 1985-04-19 1986-10-28 Nippon Telegr & Teleph Corp <Ntt> Bonding process of semiconductor substrate
JPS61292934A (en) * 1985-06-21 1986-12-23 Toshiba Corp Manufacture of semiconductor element
JPS62177938A (en) * 1986-01-31 1987-08-04 Nippon Telegr & Teleph Corp <Ntt> Manufacture of composite substrate with mutually separated island region consisting of plurality of material on same plane

Also Published As

Publication number Publication date
JPS553007B2 (en) 1980-01-23

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