JPS5329831B1 - - Google Patents

Info

Publication number
JPS5329831B1
JPS5329831B1 JP733772A JP733772A JPS5329831B1 JP S5329831 B1 JPS5329831 B1 JP S5329831B1 JP 733772 A JP733772 A JP 733772A JP 733772 A JP733772 A JP 733772A JP S5329831 B1 JPS5329831 B1 JP S5329831B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP733772A
Other languages
Japanese (ja)
Inventor
Y Hill
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5329831B1 publication Critical patent/JPS5329831B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguides (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP733772A 1971-03-19 1972-01-20 Pending JPS5329831B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12597171A 1971-03-19 1971-03-19

Publications (1)

Publication Number Publication Date
JPS5329831B1 true JPS5329831B1 (en) 1978-08-23

Family

ID=22422330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP733772A Pending JPS5329831B1 (en) 1971-03-19 1972-01-20

Country Status (7)

Country Link
US (1) US3740678A (en)
JP (1) JPS5329831B1 (en)
CA (1) CA963110A (en)
DE (1) DE2212735C3 (en)
FR (1) FR2130098B1 (en)
GB (1) GB1315918A (en)
IT (1) IT947671B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54121429A (en) * 1978-03-13 1979-09-20 Omron Tateisi Electronics Co Combustion control system

Families Citing this family (49)

* Cited by examiner, † Cited by third party
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US3878485A (en) * 1972-06-15 1975-04-15 Sits Soc It Telecom Siemens Transmission line for TDM communication system
US3895435A (en) * 1974-01-23 1975-07-22 Raytheon Co Method for electrically interconnecting multilevel stripline circuitry
US4335180A (en) * 1978-12-26 1982-06-15 Rogers Corporation Microwave circuit boards
JPS55156395A (en) * 1979-05-24 1980-12-05 Fujitsu Ltd Method of fabricating hollow multilayer printed board
GB2060266B (en) * 1979-10-05 1984-05-31 Borrill P L Multilayer printed circuit board
DE3173301D1 (en) * 1980-08-06 1986-02-06 Terry Roy Jackson Electrical power supply having a variable output
US4464704A (en) * 1980-09-26 1984-08-07 Sperry Corporation Polyimide/glass-epoxy/glass hybrid printed circuit board
US4498122A (en) * 1982-12-29 1985-02-05 At&T Bell Laboratories High-speed, high pin-out LSI chip package
US4583150A (en) * 1983-01-21 1986-04-15 Methode Electronics, Inc. Printed circuit boards
US4489999A (en) * 1983-02-15 1984-12-25 Motorola, Inc. Socket and flexible PC board assembly and method for making
US4754371A (en) * 1984-04-27 1988-06-28 Nec Corporation Large scale integrated circuit package
US4739448A (en) * 1984-06-25 1988-04-19 Magnavox Government And Industrial Electronics Company Microwave multiport multilayered integrated circuit chip carrier
JPH023631Y2 (en) * 1984-12-28 1990-01-29
GB8505581D0 (en) * 1985-03-05 1985-04-03 Oxley Dev Co Ltd Packages for electronic circuits
JPS61220499A (en) * 1985-03-27 1986-09-30 株式会社日立製作所 Hybrid multilayer interconnection substrate
IL74937A0 (en) * 1985-04-16 1985-08-30 Israel State Microwave diode phase shifter
US5036379A (en) * 1986-10-11 1991-07-30 Microelectronics And Computer Technology Corporation Electrical interconnect tape
GB8626828D0 (en) * 1986-10-11 1986-12-10 Microelectronics & Computer Pressure contact interconnect from tape
US5114518A (en) * 1986-10-23 1992-05-19 International Business Machines Corporation Method of making multilayer circuit boards having conformal Insulating layers
FR2615337A1 (en) * 1987-05-15 1988-11-18 Comp Generale Electricite Heavy-current pulse generator
US5136123A (en) * 1987-07-17 1992-08-04 Junkosha Co., Ltd. Multilayer circuit board
US4824511A (en) * 1987-10-19 1989-04-25 E. I. Du Pont De Nemours And Company Multilayer circuit board with fluoropolymer interlayers
US4870377A (en) * 1987-11-27 1989-09-26 General Electric Company Electronic circuit substrate construction
FR2625373B1 (en) * 1987-12-29 1990-01-26 Thomson Hybrides Microondes MICROBAND MICROWAVE PROPAGATION LINE
US4864722A (en) * 1988-03-16 1989-09-12 International Business Machines Corporation Low dielectric printed circuit boards
US4854038A (en) * 1988-03-16 1989-08-08 International Business Machines Corporation Modularized fabrication of high performance printed circuit boards
US4900878A (en) * 1988-10-03 1990-02-13 Hughes Aircraft Company Circuit terminations having improved electrical and structural integrity
FI113937B (en) * 1989-02-21 2004-06-30 Tatsuta Electric Wire & Gable Printed circuit board and method for its production
US5061824A (en) * 1989-08-23 1991-10-29 Ncr Corporation Backpanel having multiple logic family signal layers
DE69122748T2 (en) * 1990-12-26 1997-05-07 Tdk Corp HIGH FREQUENCY DEVICE
JPH04257287A (en) * 1991-02-08 1992-09-11 Gurafuiko:Kk Printed wiring board
US5311406A (en) * 1991-10-30 1994-05-10 Honeywell Inc. Microstrip printed wiring board and a method for making same
JPH05283888A (en) * 1992-03-31 1993-10-29 Cmk Corp Printed wiring board and its manufacture
US5397861A (en) * 1992-10-21 1995-03-14 Mupac Corporation Electrical interconnection board
DE4236593A1 (en) * 1992-10-29 1994-05-05 Siemens Ag Backplane circuit board for a module frame
US5373299A (en) * 1993-05-21 1994-12-13 Trw Inc. Low-profile wideband mode forming network
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US6163233A (en) * 1998-07-30 2000-12-19 Harris Corporation Waveguide with signal track cross-over and variable features
JP3617388B2 (en) * 1999-10-20 2005-02-02 日本電気株式会社 Printed wiring board and manufacturing method thereof
US6605551B2 (en) * 2000-12-08 2003-08-12 Intel Corporation Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance
US6888427B2 (en) * 2003-01-13 2005-05-03 Xandex, Inc. Flex-circuit-based high speed transmission line
US7295024B2 (en) * 2005-02-17 2007-11-13 Xandex, Inc. Contact signal blocks for transmission of high-speed signals
WO2006104613A2 (en) 2005-03-01 2006-10-05 X2Y Attenuators, Llc Conditioner with coplanar conductors
US9949360B2 (en) * 2011-03-10 2018-04-17 Mediatek Inc. Printed circuit board design for high speed application
US9627736B1 (en) 2013-10-23 2017-04-18 Mark W. Ingalls Multi-layer microwave crossover connected by vertical vias having partial arc shapes
CN104269647B (en) * 2014-09-09 2017-12-22 西安华为技术有限公司 A kind of phase shifter
US10784553B2 (en) 2018-09-07 2020-09-22 International Business Machines Corporation Well thermalized stripline formation for high-density connections in quantum applications

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL202113A (en) * 1954-03-05
US3104363A (en) * 1960-07-25 1963-09-17 Sanders Associates Inc Strip transmission line crossover having reduced impedance discontinuity
US3057952A (en) * 1960-10-31 1962-10-09 Sanders Associates Inc Multi-ply flexible wiring unit
US3157857A (en) * 1961-09-29 1964-11-17 Indternat Business Machines Co Printed memory circuit
US3303439A (en) * 1965-06-14 1967-02-07 Western Electric Co Strip transmission line interboard connection
US3436819A (en) * 1965-09-22 1969-04-08 Litton Systems Inc Multilayer laminate
US3518688A (en) * 1965-11-22 1970-06-30 Itt Microwave strip transmission line adapted for integral slot antenna
US3680005A (en) * 1966-03-24 1972-07-25 Burroughs Corp Integral electrical power distribution network having stacked plural circuit planes of differing characteristic impedance with intermediate ground plane for separating circuit planes
US3408453A (en) * 1967-04-04 1968-10-29 Cerro Corp Polyimide covered conductor
US3508330A (en) * 1967-04-06 1970-04-28 Gen Dynamics Corp Method of fabricating multitube electronic circuit boards
FR1552207A (en) * 1967-11-22 1969-01-03
US3612744A (en) * 1969-02-27 1971-10-12 Hughes Aircraft Co Flexible flat conductor cable of variable electrical characteristics

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54121429A (en) * 1978-03-13 1979-09-20 Omron Tateisi Electronics Co Combustion control system

Also Published As

Publication number Publication date
DE2212735A1 (en) 1972-09-28
CA963110A (en) 1975-02-18
DE2212735C3 (en) 1980-06-26
DE2212735B2 (en) 1979-10-11
FR2130098B1 (en) 1974-08-02
FR2130098A1 (en) 1972-11-03
GB1315918A (en) 1973-05-09
IT947671B (en) 1973-05-30
US3740678A (en) 1973-06-19

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