JPS5329576B2 - - Google Patents
Info
- Publication number
- JPS5329576B2 JPS5329576B2 JP1259875A JP1259875A JPS5329576B2 JP S5329576 B2 JPS5329576 B2 JP S5329576B2 JP 1259875 A JP1259875 A JP 1259875A JP 1259875 A JP1259875 A JP 1259875A JP S5329576 B2 JPS5329576 B2 JP S5329576B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1259875A JPS5329576B2 (en:Method) | 1975-01-31 | 1975-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1259875A JPS5329576B2 (en:Method) | 1975-01-31 | 1975-01-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5188185A JPS5188185A (en:Method) | 1976-08-02 |
| JPS5329576B2 true JPS5329576B2 (en:Method) | 1978-08-22 |
Family
ID=11809779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1259875A Expired JPS5329576B2 (en:Method) | 1975-01-31 | 1975-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5329576B2 (en:Method) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5626444A (en) * | 1979-08-10 | 1981-03-14 | Toshiba Corp | Manufacture of semiconductor device |
| JPS58124948U (ja) * | 1982-02-17 | 1983-08-25 | シャープ株式会社 | ワイヤボンデイング装置 |
-
1975
- 1975-01-31 JP JP1259875A patent/JPS5329576B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5188185A (en:Method) | 1976-08-02 |