JPS5329430B2 - - Google Patents

Info

Publication number
JPS5329430B2
JPS5329430B2 JP12272172A JP12272172A JPS5329430B2 JP S5329430 B2 JPS5329430 B2 JP S5329430B2 JP 12272172 A JP12272172 A JP 12272172A JP 12272172 A JP12272172 A JP 12272172A JP S5329430 B2 JPS5329430 B2 JP S5329430B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12272172A
Other languages
Japanese (ja)
Other versions
JPS4980567A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12272172A priority Critical patent/JPS5329430B2/ja
Publication of JPS4980567A publication Critical patent/JPS4980567A/ja
Publication of JPS5329430B2 publication Critical patent/JPS5329430B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP12272172A 1972-12-05 1972-12-05 Expired JPS5329430B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12272172A JPS5329430B2 (enrdf_load_stackoverflow) 1972-12-05 1972-12-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12272172A JPS5329430B2 (enrdf_load_stackoverflow) 1972-12-05 1972-12-05

Publications (2)

Publication Number Publication Date
JPS4980567A JPS4980567A (enrdf_load_stackoverflow) 1974-08-03
JPS5329430B2 true JPS5329430B2 (enrdf_load_stackoverflow) 1978-08-21

Family

ID=14842932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12272172A Expired JPS5329430B2 (enrdf_load_stackoverflow) 1972-12-05 1972-12-05

Country Status (1)

Country Link
JP (1) JPS5329430B2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS4980567A (enrdf_load_stackoverflow) 1974-08-03

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