JPS5329272B2 - - Google Patents

Info

Publication number
JPS5329272B2
JPS5329272B2 JP8233872A JP8233872A JPS5329272B2 JP S5329272 B2 JPS5329272 B2 JP S5329272B2 JP 8233872 A JP8233872 A JP 8233872A JP 8233872 A JP8233872 A JP 8233872A JP S5329272 B2 JPS5329272 B2 JP S5329272B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8233872A
Other languages
Japanese (ja)
Other versions
JPS4940067A (sv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8233872A priority Critical patent/JPS5329272B2/ja
Publication of JPS4940067A publication Critical patent/JPS4940067A/ja
Publication of JPS5329272B2 publication Critical patent/JPS5329272B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP8233872A 1972-08-17 1972-08-17 Expired JPS5329272B2 (sv)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8233872A JPS5329272B2 (sv) 1972-08-17 1972-08-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8233872A JPS5329272B2 (sv) 1972-08-17 1972-08-17

Publications (2)

Publication Number Publication Date
JPS4940067A JPS4940067A (sv) 1974-04-15
JPS5329272B2 true JPS5329272B2 (sv) 1978-08-19

Family

ID=13771763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8233872A Expired JPS5329272B2 (sv) 1972-08-17 1972-08-17

Country Status (1)

Country Link
JP (1) JPS5329272B2 (sv)

Also Published As

Publication number Publication date
JPS4940067A (sv) 1974-04-15

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