JPS5329069A - Automatic wire bonding device - Google Patents

Automatic wire bonding device

Info

Publication number
JPS5329069A
JPS5329069A JP10384176A JP10384176A JPS5329069A JP S5329069 A JPS5329069 A JP S5329069A JP 10384176 A JP10384176 A JP 10384176A JP 10384176 A JP10384176 A JP 10384176A JP S5329069 A JPS5329069 A JP S5329069A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding device
automatic wire
eliminating
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10384176A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5751929B2 (ref
Inventor
Kazuo Yoshimoto
Kazuyuki Morita
Tsunehiro Kajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP10384176A priority Critical patent/JPS5329069A/ja
Publication of JPS5329069A publication Critical patent/JPS5329069A/ja
Publication of JPS5751929B2 publication Critical patent/JPS5751929B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding

Landscapes

  • Wire Bonding (AREA)
JP10384176A 1976-08-31 1976-08-31 Automatic wire bonding device Granted JPS5329069A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10384176A JPS5329069A (en) 1976-08-31 1976-08-31 Automatic wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10384176A JPS5329069A (en) 1976-08-31 1976-08-31 Automatic wire bonding device

Publications (2)

Publication Number Publication Date
JPS5329069A true JPS5329069A (en) 1978-03-17
JPS5751929B2 JPS5751929B2 (ref) 1982-11-05

Family

ID=14364645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10384176A Granted JPS5329069A (en) 1976-08-31 1976-08-31 Automatic wire bonding device

Country Status (1)

Country Link
JP (1) JPS5329069A (ref)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4890476A (ref) * 1972-02-29 1973-11-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4890476A (ref) * 1972-02-29 1973-11-26

Also Published As

Publication number Publication date
JPS5751929B2 (ref) 1982-11-05

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