JPS5328579A - Removing agents of scale - Google Patents

Removing agents of scale

Info

Publication number
JPS5328579A
JPS5328579A JP10338876A JP10338876A JPS5328579A JP S5328579 A JPS5328579 A JP S5328579A JP 10338876 A JP10338876 A JP 10338876A JP 10338876 A JP10338876 A JP 10338876A JP S5328579 A JPS5328579 A JP S5328579A
Authority
JP
Japan
Prior art keywords
scale
removing agents
agents
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10338876A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5533679B2 (Direct
Inventor
Itsuo Kawamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koei Chemical Co Ltd
Original Assignee
Koei Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koei Chemical Co Ltd filed Critical Koei Chemical Co Ltd
Priority to JP10338876A priority Critical patent/JPS5328579A/ja
Publication of JPS5328579A publication Critical patent/JPS5328579A/ja
Publication of JPS5533679B2 publication Critical patent/JPS5533679B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
JP10338876A 1976-08-30 1976-08-30 Removing agents of scale Granted JPS5328579A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10338876A JPS5328579A (en) 1976-08-30 1976-08-30 Removing agents of scale

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10338876A JPS5328579A (en) 1976-08-30 1976-08-30 Removing agents of scale

Publications (2)

Publication Number Publication Date
JPS5328579A true JPS5328579A (en) 1978-03-16
JPS5533679B2 JPS5533679B2 (Direct) 1980-09-02

Family

ID=14352683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10338876A Granted JPS5328579A (en) 1976-08-30 1976-08-30 Removing agents of scale

Country Status (1)

Country Link
JP (1) JPS5328579A (Direct)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753204A (en) * 1980-09-16 1982-03-30 Daicel Chem Ind Ltd Method for washing membrane module
US6162301A (en) * 1997-10-21 2000-12-19 Lam Research Corporation Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
US6303551B1 (en) 1997-10-21 2001-10-16 Lam Research Corporation Cleaning solution and method for cleaning semiconductor substrates after polishing of cooper film
US6479443B1 (en) 1997-10-21 2002-11-12 Lam Research Corporation Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film
US6593282B1 (en) 1997-10-21 2003-07-15 Lam Research Corporation Cleaning solutions for semiconductor substrates after polishing of copper film

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4939736A (Direct) * 1972-08-29 1974-04-13
JPS4947606A (Direct) * 1972-09-09 1974-05-08
JPS5085587A (Direct) * 1973-12-03 1975-07-10

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4939736A (Direct) * 1972-08-29 1974-04-13
JPS4947606A (Direct) * 1972-09-09 1974-05-08
JPS5085587A (Direct) * 1973-12-03 1975-07-10

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753204A (en) * 1980-09-16 1982-03-30 Daicel Chem Ind Ltd Method for washing membrane module
US6162301A (en) * 1997-10-21 2000-12-19 Lam Research Corporation Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
US6165956A (en) * 1997-10-21 2000-12-26 Lam Research Corporation Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
US6303551B1 (en) 1997-10-21 2001-10-16 Lam Research Corporation Cleaning solution and method for cleaning semiconductor substrates after polishing of cooper film
US6479443B1 (en) 1997-10-21 2002-11-12 Lam Research Corporation Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film
US6593282B1 (en) 1997-10-21 2003-07-15 Lam Research Corporation Cleaning solutions for semiconductor substrates after polishing of copper film

Also Published As

Publication number Publication date
JPS5533679B2 (Direct) 1980-09-02

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