JPS5328359B2 - - Google Patents
Info
- Publication number
- JPS5328359B2 JPS5328359B2 JP4649475A JP4649475A JPS5328359B2 JP S5328359 B2 JPS5328359 B2 JP S5328359B2 JP 4649475 A JP4649475 A JP 4649475A JP 4649475 A JP4649475 A JP 4649475A JP S5328359 B2 JPS5328359 B2 JP S5328359B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4649475A JPS51132267A (en) | 1975-04-18 | 1975-04-18 | An epoxy resin composition for sealing semi-conductor elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4649475A JPS51132267A (en) | 1975-04-18 | 1975-04-18 | An epoxy resin composition for sealing semi-conductor elements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51132267A JPS51132267A (en) | 1976-11-17 |
| JPS5328359B2 true JPS5328359B2 (no) | 1978-08-14 |
Family
ID=12748764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4649475A Granted JPS51132267A (en) | 1975-04-18 | 1975-04-18 | An epoxy resin composition for sealing semi-conductor elements |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51132267A (no) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6325604U (no) * | 1986-08-05 | 1988-02-19 | ||
| JPS63141347U (no) * | 1987-03-09 | 1988-09-19 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5967660A (ja) * | 1982-10-12 | 1984-04-17 | Toshiba Corp | 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49118797A (no) * | 1973-03-19 | 1974-11-13 |
-
1975
- 1975-04-18 JP JP4649475A patent/JPS51132267A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49118797A (no) * | 1973-03-19 | 1974-11-13 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6325604U (no) * | 1986-08-05 | 1988-02-19 | ||
| JPS63141347U (no) * | 1987-03-09 | 1988-09-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51132267A (en) | 1976-11-17 |