JPS5328342B2 - - Google Patents
Info
- Publication number
- JPS5328342B2 JPS5328342B2 JP9817975A JP9817975A JPS5328342B2 JP S5328342 B2 JPS5328342 B2 JP S5328342B2 JP 9817975 A JP9817975 A JP 9817975A JP 9817975 A JP9817975 A JP 9817975A JP S5328342 B2 JPS5328342 B2 JP S5328342B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76804—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics by forming tapered via holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50098179A JPS5222071A (en) | 1975-08-13 | 1975-08-13 | Method of selective etching of film of polyamide resin |
NL7604652A NL7604652A (en) | 1975-08-13 | 1976-04-29 | PROCESS FOR THE MANUFACTURE OF SEMICONDUCTORS. |
DE2618937A DE2618937C3 (en) | 1975-08-13 | 1976-04-29 | Etchants for polymer resins, in particular for the manufacture of semiconductors, and processes for the manufacture of semiconductor components using this etchant |
GB17720/76A GB1510944A (en) | 1975-08-13 | 1976-04-30 | Method for fabricating semiconductor device and etchant for polymer resin |
FR7613338A FR2321190A1 (en) | 1975-08-13 | 1976-05-05 | SEMICONDUCTOR COMPONENT AND ITS MANUFACTURING PROCESS |
US05/695,040 US4113550A (en) | 1974-08-23 | 1976-06-11 | Method for fabricating semiconductor device and etchant for polymer resin |
US05/924,008 US4218283A (en) | 1974-08-23 | 1978-07-12 | Method for fabricating semiconductor device and etchant for polymer resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50098179A JPS5222071A (en) | 1975-08-13 | 1975-08-13 | Method of selective etching of film of polyamide resin |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5151979A Division JPS557880A (en) | 1979-04-27 | 1979-04-27 | Etching solution for organic resin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5222071A JPS5222071A (en) | 1977-02-19 |
JPS5328342B2 true JPS5328342B2 (en) | 1978-08-14 |
Family
ID=14212791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50098179A Granted JPS5222071A (en) | 1974-08-23 | 1975-08-13 | Method of selective etching of film of polyamide resin |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5222071A (en) |
DE (1) | DE2618937C3 (en) |
FR (1) | FR2321190A1 (en) |
GB (1) | GB1510944A (en) |
NL (1) | NL7604652A (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54106599A (en) * | 1978-02-09 | 1979-08-21 | Hitachi Chem Co Ltd | Preparation of polyamide intermediate for semiconductor processing |
JPS54179102U (en) * | 1978-06-07 | 1979-12-18 | ||
JPS5515502A (en) * | 1978-07-18 | 1980-02-02 | Hitachi Ltd | Running control system for manless wagon |
JPS557880A (en) * | 1979-04-27 | 1980-01-21 | Hitachi Ltd | Etching solution for organic resin |
JPS58108229A (en) * | 1981-12-21 | 1983-06-28 | Hitachi Ltd | Selective etching of polyimide resin film |
FR2550660B2 (en) * | 1982-04-14 | 1987-11-06 | Commissariat Energie Atomique | IMPROVEMENT IN THE METHOD OF POSITIONING AN INTERCONNECTION LINE ON AN ELECTRIC CONTACT HOLE OF AN INTEGRATED CIRCUIT |
FR2525389A1 (en) * | 1982-04-14 | 1983-10-21 | Commissariat Energie Atomique | METHOD FOR POSITIONING AN INTERCONNECTION LINE ON AN ELECTRIC CONTACT HOLE IN AN INTEGRATED CIRCUIT |
FR2537779B1 (en) * | 1982-12-10 | 1986-03-14 | Commissariat Energie Atomique | METHOD FOR POSITIONING AN ELECTRIC CONTACT HOLE BETWEEN TWO INTERCONNECTION LINES OF AN INTEGRATED CIRCUIT |
DE3475856D1 (en) * | 1983-08-12 | 1989-02-02 | Commissariat Energie Atomique | Method for aligning a connecting line above an electrical contact hole of an integrated circuit |
EP0511691A3 (en) * | 1988-07-13 | 1993-03-03 | International Business Machines Corporation | Wet etching of cured polyimide |
WO1996022597A1 (en) | 1995-01-17 | 1996-07-25 | Nippon Steel Chemical Co., Ltd. | Laminate |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49120504A (en) * | 1973-03-16 | 1974-11-18 |
-
1975
- 1975-08-13 JP JP50098179A patent/JPS5222071A/en active Granted
-
1976
- 1976-04-29 DE DE2618937A patent/DE2618937C3/en not_active Expired
- 1976-04-29 NL NL7604652A patent/NL7604652A/en not_active Application Discontinuation
- 1976-04-30 GB GB17720/76A patent/GB1510944A/en not_active Expired
- 1976-05-05 FR FR7613338A patent/FR2321190A1/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49120504A (en) * | 1973-03-16 | 1974-11-18 |
Also Published As
Publication number | Publication date |
---|---|
DE2618937C3 (en) | 1979-02-22 |
JPS5222071A (en) | 1977-02-19 |
FR2321190A1 (en) | 1977-03-11 |
GB1510944A (en) | 1978-05-17 |
DE2618937A1 (en) | 1977-02-17 |
DE2618937B2 (en) | 1978-06-29 |
NL7604652A (en) | 1977-02-15 |
FR2321190B1 (en) | 1979-08-17 |