JPS5326119B2 - - Google Patents

Info

Publication number
JPS5326119B2
JPS5326119B2 JP8472071A JP8472071A JPS5326119B2 JP S5326119 B2 JPS5326119 B2 JP S5326119B2 JP 8472071 A JP8472071 A JP 8472071A JP 8472071 A JP8472071 A JP 8472071A JP S5326119 B2 JPS5326119 B2 JP S5326119B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8472071A
Other languages
Japanese (ja)
Other versions
JPS4851588A (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8472071A priority Critical patent/JPS5326119B2/ja
Publication of JPS4851588A publication Critical patent/JPS4851588A/ja
Publication of JPS5326119B2 publication Critical patent/JPS5326119B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Light Receiving Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP8472071A 1971-10-27 1971-10-27 Expired JPS5326119B2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8472071A JPS5326119B2 (enExample) 1971-10-27 1971-10-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8472071A JPS5326119B2 (enExample) 1971-10-27 1971-10-27

Publications (2)

Publication Number Publication Date
JPS4851588A JPS4851588A (enExample) 1973-07-19
JPS5326119B2 true JPS5326119B2 (enExample) 1978-07-31

Family

ID=13838502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8472071A Expired JPS5326119B2 (enExample) 1971-10-27 1971-10-27

Country Status (1)

Country Link
JP (1) JPS5326119B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0268305U (enExample) * 1988-11-08 1990-05-23

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53138287A (en) * 1977-05-10 1978-12-02 Agency Of Ind Science & Technol Solar battery
JPH0440554U (enExample) * 1990-07-31 1992-04-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0268305U (enExample) * 1988-11-08 1990-05-23

Also Published As

Publication number Publication date
JPS4851588A (enExample) 1973-07-19

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