JPS5324259U - - Google Patents

Info

Publication number
JPS5324259U
JPS5324259U JP1976106641U JP10664176U JPS5324259U JP S5324259 U JPS5324259 U JP S5324259U JP 1976106641 U JP1976106641 U JP 1976106641U JP 10664176 U JP10664176 U JP 10664176U JP S5324259 U JPS5324259 U JP S5324259U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1976106641U
Other languages
Japanese (ja)
Other versions
JPS5727141Y2 (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976106641U priority Critical patent/JPS5727141Y2/ja
Publication of JPS5324259U publication Critical patent/JPS5324259U/ja
Application granted granted Critical
Publication of JPS5727141Y2 publication Critical patent/JPS5727141Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1976106641U 1976-08-09 1976-08-09 Expired JPS5727141Y2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976106641U JPS5727141Y2 (fr) 1976-08-09 1976-08-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976106641U JPS5727141Y2 (fr) 1976-08-09 1976-08-09

Publications (2)

Publication Number Publication Date
JPS5324259U true JPS5324259U (fr) 1978-03-01
JPS5727141Y2 JPS5727141Y2 (fr) 1982-06-14

Family

ID=28716728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976106641U Expired JPS5727141Y2 (fr) 1976-08-09 1976-08-09

Country Status (1)

Country Link
JP (1) JPS5727141Y2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08153751A (ja) * 1994-08-31 1996-06-11 Nec Corp 電子デバイス組立体およびその製造方法
JPH08153750A (ja) * 1994-08-31 1996-06-11 Nec Corp 電子デバイス組立体およびその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4868170A (fr) * 1971-12-20 1973-09-17
JPS50140063A (fr) * 1974-04-25 1975-11-10

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4868170A (fr) * 1971-12-20 1973-09-17
JPS50140063A (fr) * 1974-04-25 1975-11-10

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08153751A (ja) * 1994-08-31 1996-06-11 Nec Corp 電子デバイス組立体およびその製造方法
JPH08153750A (ja) * 1994-08-31 1996-06-11 Nec Corp 電子デバイス組立体およびその製造方法

Also Published As

Publication number Publication date
JPS5727141Y2 (fr) 1982-06-14

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