JPS5324259U - - Google Patents

Info

Publication number
JPS5324259U
JPS5324259U JP1976106641U JP10664176U JPS5324259U JP S5324259 U JPS5324259 U JP S5324259U JP 1976106641 U JP1976106641 U JP 1976106641U JP 10664176 U JP10664176 U JP 10664176U JP S5324259 U JPS5324259 U JP S5324259U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1976106641U
Other languages
Japanese (ja)
Other versions
JPS5727141Y2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976106641U priority Critical patent/JPS5727141Y2/ja
Publication of JPS5324259U publication Critical patent/JPS5324259U/ja
Application granted granted Critical
Publication of JPS5727141Y2 publication Critical patent/JPS5727141Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1976106641U 1976-08-09 1976-08-09 Expired JPS5727141Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976106641U JPS5727141Y2 (enrdf_load_html_response) 1976-08-09 1976-08-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976106641U JPS5727141Y2 (enrdf_load_html_response) 1976-08-09 1976-08-09

Publications (2)

Publication Number Publication Date
JPS5324259U true JPS5324259U (enrdf_load_html_response) 1978-03-01
JPS5727141Y2 JPS5727141Y2 (enrdf_load_html_response) 1982-06-14

Family

ID=28716728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976106641U Expired JPS5727141Y2 (enrdf_load_html_response) 1976-08-09 1976-08-09

Country Status (1)

Country Link
JP (1) JPS5727141Y2 (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08153751A (ja) * 1994-08-31 1996-06-11 Nec Corp 電子デバイス組立体およびその製造方法
JPH08153750A (ja) * 1994-08-31 1996-06-11 Nec Corp 電子デバイス組立体およびその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4868170A (enrdf_load_html_response) * 1971-12-20 1973-09-17
JPS50140063A (enrdf_load_html_response) * 1974-04-25 1975-11-10

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4868170A (enrdf_load_html_response) * 1971-12-20 1973-09-17
JPS50140063A (enrdf_load_html_response) * 1974-04-25 1975-11-10

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08153751A (ja) * 1994-08-31 1996-06-11 Nec Corp 電子デバイス組立体およびその製造方法
JPH08153750A (ja) * 1994-08-31 1996-06-11 Nec Corp 電子デバイス組立体およびその製造方法

Also Published As

Publication number Publication date
JPS5727141Y2 (enrdf_load_html_response) 1982-06-14

Similar Documents

Publication Publication Date Title
DE2649042C2 (enrdf_load_html_response)
DE2656389B2 (enrdf_load_html_response)
DE2760279A1 (enrdf_load_html_response)
FR2339847B1 (enrdf_load_html_response)
DE2709079C3 (enrdf_load_html_response)
JPS5547499Y2 (enrdf_load_html_response)
DE2616798C2 (enrdf_load_html_response)
JPS5651187B2 (enrdf_load_html_response)
JPS5324259U (enrdf_load_html_response)
JPS5314108U (enrdf_load_html_response)
JPS5319095U (enrdf_load_html_response)
JPS5333229U (enrdf_load_html_response)
JPS5324254U (enrdf_load_html_response)
JPS5324255U (enrdf_load_html_response)
JPS562844Y2 (enrdf_load_html_response)
JPS5647938Y2 (enrdf_load_html_response)
JPS5419216B2 (enrdf_load_html_response)
JPS531599U (enrdf_load_html_response)
IN144399B (enrdf_load_html_response)
CS178376B1 (enrdf_load_html_response)
JPS52146531U (enrdf_load_html_response)
JPS52170116U (enrdf_load_html_response)
CS178379B1 (enrdf_load_html_response)
JPS5364662U (enrdf_load_html_response)
JPS5381087U (enrdf_load_html_response)