JPS5324259U - - Google Patents
Info
- Publication number
- JPS5324259U JPS5324259U JP1976106641U JP10664176U JPS5324259U JP S5324259 U JPS5324259 U JP S5324259U JP 1976106641 U JP1976106641 U JP 1976106641U JP 10664176 U JP10664176 U JP 10664176U JP S5324259 U JPS5324259 U JP S5324259U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976106641U JPS5727141Y2 (cg-RX-API-DMAC10.html) | 1976-08-09 | 1976-08-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976106641U JPS5727141Y2 (cg-RX-API-DMAC10.html) | 1976-08-09 | 1976-08-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5324259U true JPS5324259U (cg-RX-API-DMAC10.html) | 1978-03-01 |
| JPS5727141Y2 JPS5727141Y2 (cg-RX-API-DMAC10.html) | 1982-06-14 |
Family
ID=28716728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976106641U Expired JPS5727141Y2 (cg-RX-API-DMAC10.html) | 1976-08-09 | 1976-08-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5727141Y2 (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08153750A (ja) * | 1994-08-31 | 1996-06-11 | Nec Corp | 電子デバイス組立体およびその製造方法 |
| JPH08153751A (ja) * | 1994-08-31 | 1996-06-11 | Nec Corp | 電子デバイス組立体およびその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4868170A (cg-RX-API-DMAC10.html) * | 1971-12-20 | 1973-09-17 | ||
| JPS50140063A (cg-RX-API-DMAC10.html) * | 1974-04-25 | 1975-11-10 |
-
1976
- 1976-08-09 JP JP1976106641U patent/JPS5727141Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4868170A (cg-RX-API-DMAC10.html) * | 1971-12-20 | 1973-09-17 | ||
| JPS50140063A (cg-RX-API-DMAC10.html) * | 1974-04-25 | 1975-11-10 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08153750A (ja) * | 1994-08-31 | 1996-06-11 | Nec Corp | 電子デバイス組立体およびその製造方法 |
| JPH08153751A (ja) * | 1994-08-31 | 1996-06-11 | Nec Corp | 電子デバイス組立体およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5727141Y2 (cg-RX-API-DMAC10.html) | 1982-06-14 |