JPS5322669U - - Google Patents
Info
- Publication number
- JPS5322669U JPS5322669U JP1976105304U JP10530476U JPS5322669U JP S5322669 U JPS5322669 U JP S5322669U JP 1976105304 U JP1976105304 U JP 1976105304U JP 10530476 U JP10530476 U JP 10530476U JP S5322669 U JPS5322669 U JP S5322669U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1976105304U JPS5322669U (fr) | 1976-08-05 | 1976-08-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1976105304U JPS5322669U (fr) | 1976-08-05 | 1976-08-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5322669U true JPS5322669U (fr) | 1978-02-25 |
Family
ID=28715463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1976105304U Pending JPS5322669U (fr) | 1976-08-05 | 1976-08-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5322669U (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11955466B2 (en) | 2020-08-25 | 2024-04-09 | Nichia Corporation | Light emitting device |
US12002909B2 (en) | 2020-08-25 | 2024-06-04 | Nichia Corporation | Surface-mounted multi-colored light emitting device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4839866B1 (fr) * | 1968-10-17 | 1973-11-27 | ||
JPS4952989A (fr) * | 1972-09-22 | 1974-05-23 |
-
1976
- 1976-08-05 JP JP1976105304U patent/JPS5322669U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4839866B1 (fr) * | 1968-10-17 | 1973-11-27 | ||
JPS4952989A (fr) * | 1972-09-22 | 1974-05-23 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11955466B2 (en) | 2020-08-25 | 2024-04-09 | Nichia Corporation | Light emitting device |
US12002909B2 (en) | 2020-08-25 | 2024-06-04 | Nichia Corporation | Surface-mounted multi-colored light emitting device |