JPS5322609U - - Google Patents
Info
- Publication number
- JPS5322609U JPS5322609U JP10461876U JP10461876U JPS5322609U JP S5322609 U JPS5322609 U JP S5322609U JP 10461876 U JP10461876 U JP 10461876U JP 10461876 U JP10461876 U JP 10461876U JP S5322609 U JPS5322609 U JP S5322609U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10461876U JPS5322609U (ro) | 1976-08-05 | 1976-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10461876U JPS5322609U (ro) | 1976-08-05 | 1976-08-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5322609U true JPS5322609U (ro) | 1978-02-25 |
Family
ID=28714782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10461876U Pending JPS5322609U (ro) | 1976-08-05 | 1976-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5322609U (ro) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230046274A (ko) | 2020-07-30 | 2023-04-05 | 후루카와 덴키 고교 가부시키가이샤 | 접착제용 조성물 및 필름형 접착제와 필름형 접착제를 사용한 반도체 패키지 및 그 제조 방법 |
-
1976
- 1976-08-05 JP JP10461876U patent/JPS5322609U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230046274A (ko) | 2020-07-30 | 2023-04-05 | 후루카와 덴키 고교 가부시키가이샤 | 접착제용 조성물 및 필름형 접착제와 필름형 접착제를 사용한 반도체 패키지 및 그 제조 방법 |