JPS532167U - - Google Patents
Info
- Publication number
- JPS532167U JPS532167U JP8268276U JP8268276U JPS532167U JP S532167 U JPS532167 U JP S532167U JP 8268276 U JP8268276 U JP 8268276U JP 8268276 U JP8268276 U JP 8268276U JP S532167 U JPS532167 U JP S532167U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8268276U JPS532167U (enExample) | 1976-06-25 | 1976-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8268276U JPS532167U (enExample) | 1976-06-25 | 1976-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS532167U true JPS532167U (enExample) | 1978-01-10 |
Family
ID=28563403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8268276U Pending JPS532167U (enExample) | 1976-06-25 | 1976-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS532167U (enExample) |
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1976
- 1976-06-25 JP JP8268276U patent/JPS532167U/ja active Pending