JPS532166U - - Google Patents

Info

Publication number
JPS532166U
JPS532166U JP8303276U JP8303276U JPS532166U JP S532166 U JPS532166 U JP S532166U JP 8303276 U JP8303276 U JP 8303276U JP 8303276 U JP8303276 U JP 8303276U JP S532166 U JPS532166 U JP S532166U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8303276U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8303276U priority Critical patent/JPS532166U/ja
Publication of JPS532166U publication Critical patent/JPS532166U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP8303276U 1976-06-23 1976-06-23 Pending JPS532166U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8303276U JPS532166U (en) 1976-06-23 1976-06-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8303276U JPS532166U (en) 1976-06-23 1976-06-23

Publications (1)

Publication Number Publication Date
JPS532166U true JPS532166U (en) 1978-01-10

Family

ID=28564035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8303276U Pending JPS532166U (en) 1976-06-23 1976-06-23

Country Status (1)

Country Link
JP (1) JPS532166U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327133U (en) * 1986-08-05 1988-02-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327133U (en) * 1986-08-05 1988-02-23

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