JPS532165U - - Google Patents

Info

Publication number
JPS532165U
JPS532165U JP1976082693U JP8269376U JPS532165U JP S532165 U JPS532165 U JP S532165U JP 1976082693 U JP1976082693 U JP 1976082693U JP 8269376 U JP8269376 U JP 8269376U JP S532165 U JPS532165 U JP S532165U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1976082693U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976082693U priority Critical patent/JPS532165U/ja
Publication of JPS532165U publication Critical patent/JPS532165U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Wire Bonding (AREA)
JP1976082693U 1976-06-25 1976-06-25 Pending JPS532165U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976082693U JPS532165U (fr) 1976-06-25 1976-06-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976082693U JPS532165U (fr) 1976-06-25 1976-06-25

Publications (1)

Publication Number Publication Date
JPS532165U true JPS532165U (fr) 1978-01-10

Family

ID=28563425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976082693U Pending JPS532165U (fr) 1976-06-25 1976-06-25

Country Status (1)

Country Link
JP (1) JPS532165U (fr)

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