JPS532165U - - Google Patents
Info
- Publication number
- JPS532165U JPS532165U JP1976082693U JP8269376U JPS532165U JP S532165 U JPS532165 U JP S532165U JP 1976082693 U JP1976082693 U JP 1976082693U JP 8269376 U JP8269376 U JP 8269376U JP S532165 U JPS532165 U JP S532165U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976082693U JPS532165U (cs) | 1976-06-25 | 1976-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976082693U JPS532165U (cs) | 1976-06-25 | 1976-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS532165U true JPS532165U (cs) | 1978-01-10 |
Family
ID=28563425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976082693U Pending JPS532165U (cs) | 1976-06-25 | 1976-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS532165U (cs) |
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1976
- 1976-06-25 JP JP1976082693U patent/JPS532165U/ja active Pending