JPS5320461B1 - - Google Patents
Info
- Publication number
- JPS5320461B1 JPS5320461B1 JP2682470A JP2682470A JPS5320461B1 JP S5320461 B1 JPS5320461 B1 JP S5320461B1 JP 2682470 A JP2682470 A JP 2682470A JP 2682470 A JP2682470 A JP 2682470A JP S5320461 B1 JPS5320461 B1 JP S5320461B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2682470A JPS5320461B1 (en) | 1970-03-30 | 1970-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2682470A JPS5320461B1 (en) | 1970-03-30 | 1970-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5320461B1 true JPS5320461B1 (en) | 1978-06-27 |
Family
ID=12204007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2682470A Pending JPS5320461B1 (en) | 1970-03-30 | 1970-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5320461B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2614915A1 (en) * | 2012-01-10 | 2013-07-17 | United Technologies Corporation | Method of diffusion bonding a component with heat a space between die sets ; corresponding machine for diffusion bonding |
-
1970
- 1970-03-30 JP JP2682470A patent/JPS5320461B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2614915A1 (en) * | 2012-01-10 | 2013-07-17 | United Technologies Corporation | Method of diffusion bonding a component with heat a space between die sets ; corresponding machine for diffusion bonding |