JPS5320388B2 - - Google Patents

Info

Publication number
JPS5320388B2
JPS5320388B2 JP8217874A JP8217874A JPS5320388B2 JP S5320388 B2 JPS5320388 B2 JP S5320388B2 JP 8217874 A JP8217874 A JP 8217874A JP 8217874 A JP8217874 A JP 8217874A JP S5320388 B2 JPS5320388 B2 JP S5320388B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8217874A
Other languages
Japanese (ja)
Other versions
JPS5111566A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8217874A priority Critical patent/JPS5320388B2/ja
Publication of JPS5111566A publication Critical patent/JPS5111566A/ja
Publication of JPS5320388B2 publication Critical patent/JPS5320388B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
JP8217874A 1974-07-19 1974-07-19 Expired JPS5320388B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8217874A JPS5320388B2 (en) 1974-07-19 1974-07-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8217874A JPS5320388B2 (en) 1974-07-19 1974-07-19

Publications (2)

Publication Number Publication Date
JPS5111566A JPS5111566A (en) 1976-01-29
JPS5320388B2 true JPS5320388B2 (en) 1978-06-26

Family

ID=13767168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8217874A Expired JPS5320388B2 (en) 1974-07-19 1974-07-19

Country Status (1)

Country Link
JP (1) JPS5320388B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0731753B2 (en) * 1985-05-22 1995-04-10 日本鋼管工事株式会社 Tunnel abnormality notification device

Also Published As

Publication number Publication date
JPS5111566A (en) 1976-01-29

Similar Documents

Publication Publication Date Title
FR2391434B1 (en)
FR2272655B1 (en)
FI753129A (en)
FR2271242B1 (en)
DK139763C (en)
FR2268978B1 (en)
FR2261465B1 (en)
JPS5111566A (en)
FR2295449B3 (en)
FR2288045B3 (en)
FR2274134B2 (en)
JPS5755214B2 (en)
JPS50103158A (en)
BG21317A1 (en)
DD112026A1 (en)
BG21753A1 (en)
BG22091A1 (en)
BG22207A1 (en)
BG21090A1 (en)
BG21048A1 (en)
BG22343A1 (en)
BG22349A1 (en)
BG22709A1 (en)
BG21710A1 (en)
BG20915A1 (en)