JPS5320058B2 - - Google Patents
Info
- Publication number
- JPS5320058B2 JPS5320058B2 JP3262074A JP3262074A JPS5320058B2 JP S5320058 B2 JPS5320058 B2 JP S5320058B2 JP 3262074 A JP3262074 A JP 3262074A JP 3262074 A JP3262074 A JP 3262074A JP S5320058 B2 JPS5320058 B2 JP S5320058B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Processes Of Treating Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3262074A JPS5320058B2 (de) | 1974-03-25 | 1974-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3262074A JPS5320058B2 (de) | 1974-03-25 | 1974-03-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50126053A JPS50126053A (de) | 1975-10-03 |
| JPS5320058B2 true JPS5320058B2 (de) | 1978-06-24 |
Family
ID=12363881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3262074A Expired JPS5320058B2 (de) | 1974-03-25 | 1974-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5320058B2 (de) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015216619A1 (de) | 2015-08-31 | 2017-03-02 | Disco Corporation | Verfahren zum Bearbeiten eines Wafers |
| DE112015006857T5 (de) | 2015-08-31 | 2018-05-24 | Karl Heinz Priewasser | Verfahren zum Bearbeiten eines Wafers und Schutzabdeckung zur Verwendung in diesem Verfahren |
| KR20190118124A (ko) * | 2018-04-09 | 2019-10-17 | 가부시기가이샤 디스코 | 보호 시트 설치 방법 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5290543A (en) * | 1976-01-23 | 1977-07-29 | Iwao Hishida | Granular compositions of waxes |
| US4244746A (en) * | 1979-07-16 | 1981-01-13 | Conoco, Inc. | Single package additive for thermoplastic formulation |
| JPS58120657A (ja) * | 1982-01-12 | 1983-07-18 | Mitsui Toatsu Chem Inc | 農業用軟質塩化ビニル樹脂フイルム |
| JP2689500B2 (ja) * | 1988-07-19 | 1997-12-10 | 旭硝子株式会社 | 樹脂用充▲てん▼材および樹脂組成物 |
| DE19817257A1 (de) * | 1998-04-19 | 1999-12-09 | Grace Gmbh | Granulatzusammensetzung aus Antiblockingmitteln und Additiven für Polymerherstellung |
-
1974
- 1974-03-25 JP JP3262074A patent/JPS5320058B2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015216619A1 (de) | 2015-08-31 | 2017-03-02 | Disco Corporation | Verfahren zum Bearbeiten eines Wafers |
| DE102015216619B4 (de) * | 2015-08-31 | 2017-08-10 | Disco Corporation | Verfahren zum Bearbeiten eines Wafers |
| DE112015006857T5 (de) | 2015-08-31 | 2018-05-24 | Karl Heinz Priewasser | Verfahren zum Bearbeiten eines Wafers und Schutzabdeckung zur Verwendung in diesem Verfahren |
| KR20190118124A (ko) * | 2018-04-09 | 2019-10-17 | 가부시기가이샤 디스코 | 보호 시트 설치 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50126053A (de) | 1975-10-03 |