JPS5319130U - - Google Patents

Info

Publication number
JPS5319130U
JPS5319130U JP10137676U JP10137676U JPS5319130U JP S5319130 U JPS5319130 U JP S5319130U JP 10137676 U JP10137676 U JP 10137676U JP 10137676 U JP10137676 U JP 10137676U JP S5319130 U JPS5319130 U JP S5319130U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10137676U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10137676U priority Critical patent/JPS5319130U/ja
Publication of JPS5319130U publication Critical patent/JPS5319130U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Infusion, Injection, And Reservoir Apparatuses (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP10137676U 1976-07-29 1976-07-29 Pending JPS5319130U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10137676U JPS5319130U (en) 1976-07-29 1976-07-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10137676U JPS5319130U (en) 1976-07-29 1976-07-29

Publications (1)

Publication Number Publication Date
JPS5319130U true JPS5319130U (en) 1978-02-18

Family

ID=28711608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10137676U Pending JPS5319130U (en) 1976-07-29 1976-07-29

Country Status (1)

Country Link
JP (1) JPS5319130U (en)

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