JPS5318384A - Apparatus for wireebonding - Google Patents

Apparatus for wireebonding

Info

Publication number
JPS5318384A
JPS5318384A JP9294376A JP9294376A JPS5318384A JP S5318384 A JPS5318384 A JP S5318384A JP 9294376 A JP9294376 A JP 9294376A JP 9294376 A JP9294376 A JP 9294376A JP S5318384 A JPS5318384 A JP S5318384A
Authority
JP
Japan
Prior art keywords
wireebonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9294376A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5750059B2 (enrdf_load_stackoverflow
Inventor
Mikiya Yamazaki
Kazuo Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP9294376A priority Critical patent/JPS5318384A/ja
Publication of JPS5318384A publication Critical patent/JPS5318384A/ja
Publication of JPS5750059B2 publication Critical patent/JPS5750059B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Wire Bonding (AREA)
JP9294376A 1976-08-04 1976-08-04 Apparatus for wireebonding Granted JPS5318384A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9294376A JPS5318384A (en) 1976-08-04 1976-08-04 Apparatus for wireebonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9294376A JPS5318384A (en) 1976-08-04 1976-08-04 Apparatus for wireebonding

Publications (2)

Publication Number Publication Date
JPS5318384A true JPS5318384A (en) 1978-02-20
JPS5750059B2 JPS5750059B2 (enrdf_load_stackoverflow) 1982-10-25

Family

ID=14068546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9294376A Granted JPS5318384A (en) 1976-08-04 1976-08-04 Apparatus for wireebonding

Country Status (1)

Country Link
JP (1) JPS5318384A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551743A (en) * 1980-08-29 1985-11-05 Tokyo Shibaura Denki Kabushiki Kaisha Semiconductor integrated circuit with isolation region made of dielectric material

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50144578U (enrdf_load_stackoverflow) * 1974-05-14 1975-11-28
JPS5115955A (ja) * 1974-07-30 1976-02-07 Nippon Electric Co Tashuhasuishohatsushinki

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50144578U (enrdf_load_stackoverflow) * 1974-05-14 1975-11-28
JPS5115955A (ja) * 1974-07-30 1976-02-07 Nippon Electric Co Tashuhasuishohatsushinki

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551743A (en) * 1980-08-29 1985-11-05 Tokyo Shibaura Denki Kabushiki Kaisha Semiconductor integrated circuit with isolation region made of dielectric material

Also Published As

Publication number Publication date
JPS5750059B2 (enrdf_load_stackoverflow) 1982-10-25

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