JPS5315267Y2 - - Google Patents

Info

Publication number
JPS5315267Y2
JPS5315267Y2 JP1972036292U JP3629272U JPS5315267Y2 JP S5315267 Y2 JPS5315267 Y2 JP S5315267Y2 JP 1972036292 U JP1972036292 U JP 1972036292U JP 3629272 U JP3629272 U JP 3629272U JP S5315267 Y2 JPS5315267 Y2 JP S5315267Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1972036292U
Other languages
Japanese (ja)
Other versions
JPS48112276U (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972036292U priority Critical patent/JPS5315267Y2/ja
Publication of JPS48112276U publication Critical patent/JPS48112276U/ja
Application granted granted Critical
Publication of JPS5315267Y2 publication Critical patent/JPS5315267Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1972036292U 1972-03-28 1972-03-28 Expired JPS5315267Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972036292U JPS5315267Y2 (en:Method) 1972-03-28 1972-03-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972036292U JPS5315267Y2 (en:Method) 1972-03-28 1972-03-28

Publications (2)

Publication Number Publication Date
JPS48112276U JPS48112276U (en:Method) 1973-12-22
JPS5315267Y2 true JPS5315267Y2 (en:Method) 1978-04-21

Family

ID=27903683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972036292U Expired JPS5315267Y2 (en:Method) 1972-03-28 1972-03-28

Country Status (1)

Country Link
JP (1) JPS5315267Y2 (en:Method)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5732608Y2 (en:Method) * 1977-04-07 1982-07-17

Also Published As

Publication number Publication date
JPS48112276U (en:Method) 1973-12-22

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