JPS53149560U - - Google Patents
Info
- Publication number
- JPS53149560U JPS53149560U JP5526077U JP5526077U JPS53149560U JP S53149560 U JPS53149560 U JP S53149560U JP 5526077 U JP5526077 U JP 5526077U JP 5526077 U JP5526077 U JP 5526077U JP S53149560 U JPS53149560 U JP S53149560U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977055260U JPS5812455Y2 (ja) | 1977-04-30 | 1977-04-30 | 半導体装置用リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977055260U JPS5812455Y2 (ja) | 1977-04-30 | 1977-04-30 | 半導体装置用リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53149560U true JPS53149560U (de) | 1978-11-25 |
| JPS5812455Y2 JPS5812455Y2 (ja) | 1983-03-09 |
Family
ID=28950879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977055260U Expired JPS5812455Y2 (ja) | 1977-04-30 | 1977-04-30 | 半導体装置用リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5812455Y2 (de) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49103375U (de) * | 1972-12-26 | 1974-09-05 |
-
1977
- 1977-04-30 JP JP1977055260U patent/JPS5812455Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49103375U (de) * | 1972-12-26 | 1974-09-05 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5812455Y2 (ja) | 1983-03-09 |