JPS53145476U - - Google Patents

Info

Publication number
JPS53145476U
JPS53145476U JP5203377U JP5203377U JPS53145476U JP S53145476 U JPS53145476 U JP S53145476U JP 5203377 U JP5203377 U JP 5203377U JP 5203377 U JP5203377 U JP 5203377U JP S53145476 U JPS53145476 U JP S53145476U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5203377U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5203377U priority Critical patent/JPS53145476U/ja
Publication of JPS53145476U publication Critical patent/JPS53145476U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
JP5203377U 1977-04-20 1977-04-20 Pending JPS53145476U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5203377U JPS53145476U (en) 1977-04-20 1977-04-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5203377U JPS53145476U (en) 1977-04-20 1977-04-20

Publications (1)

Publication Number Publication Date
JPS53145476U true JPS53145476U (en) 1978-11-16

Family

ID=28942485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5203377U Pending JPS53145476U (en) 1977-04-20 1977-04-20

Country Status (1)

Country Link
JP (1) JPS53145476U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010525569A (en) * 2007-04-19 2010-07-22 エルジー イノテック カンパニー リミテッド Light emitting device package and light unit including the same
JP2010161139A (en) * 2009-01-07 2010-07-22 Toshiba Corp Light emitting device

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8536586B2 (en) 2007-04-19 2013-09-17 Lg Innotek Co., Ltd. Light emitting device package and light unit having the same
JP2010525569A (en) * 2007-04-19 2010-07-22 エルジー イノテック カンパニー リミテッド Light emitting device package and light unit including the same
JP2012109611A (en) * 2007-04-19 2012-06-07 Lg Innotek Co Ltd Semiconductor diode package and method for manufacturing the same
JP2012109612A (en) * 2007-04-19 2012-06-07 Lg Innotek Co Ltd Semiconductor diode package and method for manufacturing the same
US8299474B2 (en) 2007-04-19 2012-10-30 Lg Innotek Co., Ltd. Light emitting device package and light unit having the same
JP2013128154A (en) * 2007-04-19 2013-06-27 Lg Innotek Co Ltd Light emitting device package and light unit having the same
US9666775B2 (en) 2007-04-19 2017-05-30 Lg Innotek Co., Ltd. Light emitting device package and light unit having the same
US8692262B2 (en) 2007-04-19 2014-04-08 Lg Innotek Co., Ltd. Light emitting device package and light unit having the same
US9018644B2 (en) 2007-04-19 2015-04-28 Lg Innotek Co., Ltd. Light emitting device package and light unit having the same
US8994038B2 (en) 2007-04-19 2015-03-31 Lg Innotek Co., Ltd. Light emitting device package and light unit having the same
US8890176B2 (en) 2007-04-19 2014-11-18 Lg Innotek Co., Ltd. Light emitting device package and light unit having the same
US9252347B2 (en) 2007-04-19 2016-02-02 Lg Innotek Co., Ltd. Light emitting device package and light unit having the same
US9559275B2 (en) 2007-04-19 2017-01-31 Lg Innotek Co., Ltd. Light emitting device package and light unit having the same
JP2010161139A (en) * 2009-01-07 2010-07-22 Toshiba Corp Light emitting device

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