JPS53145464U - - Google Patents

Info

Publication number
JPS53145464U
JPS53145464U JP1977036345U JP3634577U JPS53145464U JP S53145464 U JPS53145464 U JP S53145464U JP 1977036345 U JP1977036345 U JP 1977036345U JP 3634577 U JP3634577 U JP 3634577U JP S53145464 U JPS53145464 U JP S53145464U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1977036345U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977036345U priority Critical patent/JPS53145464U/ja
Publication of JPS53145464U publication Critical patent/JPS53145464U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1977036345U 1977-03-25 1977-03-25 Pending JPS53145464U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977036345U JPS53145464U (enrdf_load_stackoverflow) 1977-03-25 1977-03-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977036345U JPS53145464U (enrdf_load_stackoverflow) 1977-03-25 1977-03-25

Publications (1)

Publication Number Publication Date
JPS53145464U true JPS53145464U (enrdf_load_stackoverflow) 1978-11-16

Family

ID=28897328

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977036345U Pending JPS53145464U (enrdf_load_stackoverflow) 1977-03-25 1977-03-25

Country Status (1)

Country Link
JP (1) JPS53145464U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991006977A1 (en) * 1989-11-06 1991-05-16 Nippon Mektron, Ltd. Flexible circuit board for mounting ic and method of producing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50147667A (enrdf_load_stackoverflow) * 1974-05-16 1975-11-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50147667A (enrdf_load_stackoverflow) * 1974-05-16 1975-11-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991006977A1 (en) * 1989-11-06 1991-05-16 Nippon Mektron, Ltd. Flexible circuit board for mounting ic and method of producing the same

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