JPS53145464U - - Google Patents
Info
- Publication number
- JPS53145464U JPS53145464U JP1977036345U JP3634577U JPS53145464U JP S53145464 U JPS53145464 U JP S53145464U JP 1977036345 U JP1977036345 U JP 1977036345U JP 3634577 U JP3634577 U JP 3634577U JP S53145464 U JPS53145464 U JP S53145464U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977036345U JPS53145464U (enrdf_load_stackoverflow) | 1977-03-25 | 1977-03-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977036345U JPS53145464U (enrdf_load_stackoverflow) | 1977-03-25 | 1977-03-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53145464U true JPS53145464U (enrdf_load_stackoverflow) | 1978-11-16 |
Family
ID=28897328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1977036345U Pending JPS53145464U (enrdf_load_stackoverflow) | 1977-03-25 | 1977-03-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53145464U (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1991006977A1 (en) * | 1989-11-06 | 1991-05-16 | Nippon Mektron, Ltd. | Flexible circuit board for mounting ic and method of producing the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50147667A (enrdf_load_stackoverflow) * | 1974-05-16 | 1975-11-26 |
-
1977
- 1977-03-25 JP JP1977036345U patent/JPS53145464U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50147667A (enrdf_load_stackoverflow) * | 1974-05-16 | 1975-11-26 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1991006977A1 (en) * | 1989-11-06 | 1991-05-16 | Nippon Mektron, Ltd. | Flexible circuit board for mounting ic and method of producing the same |