JPS53145161U - - Google Patents

Info

Publication number
JPS53145161U
JPS53145161U JP1977050613U JP5061377U JPS53145161U JP S53145161 U JPS53145161 U JP S53145161U JP 1977050613 U JP1977050613 U JP 1977050613U JP 5061377 U JP5061377 U JP 5061377U JP S53145161 U JPS53145161 U JP S53145161U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1977050613U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977050613U priority Critical patent/JPS53145161U/ja
Publication of JPS53145161U publication Critical patent/JPS53145161U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Electric Clocks (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1977050613U 1977-04-21 1977-04-21 Pending JPS53145161U (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977050613U JPS53145161U (https=) 1977-04-21 1977-04-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977050613U JPS53145161U (https=) 1977-04-21 1977-04-21

Publications (1)

Publication Number Publication Date
JPS53145161U true JPS53145161U (https=) 1978-11-15

Family

ID=28938412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977050613U Pending JPS53145161U (https=) 1977-04-21 1977-04-21

Country Status (1)

Country Link
JP (1) JPS53145161U (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5038445B1 (https=) * 1970-04-23 1975-12-10
JPS522154B1 (https=) * 1969-07-03 1977-01-20

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS522154B1 (https=) * 1969-07-03 1977-01-20
JPS5038445B1 (https=) * 1970-04-23 1975-12-10

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