JPS5314470U - - Google Patents

Info

Publication number
JPS5314470U
JPS5314470U JP9673876U JP9673876U JPS5314470U JP S5314470 U JPS5314470 U JP S5314470U JP 9673876 U JP9673876 U JP 9673876U JP 9673876 U JP9673876 U JP 9673876U JP S5314470 U JPS5314470 U JP S5314470U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9673876U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9673876U priority Critical patent/JPS5314470U/ja
Publication of JPS5314470U publication Critical patent/JPS5314470U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
JP9673876U 1976-07-19 1976-07-19 Pending JPS5314470U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9673876U JPS5314470U (ja) 1976-07-19 1976-07-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9673876U JPS5314470U (ja) 1976-07-19 1976-07-19

Publications (1)

Publication Number Publication Date
JPS5314470U true JPS5314470U (ja) 1978-02-06

Family

ID=28707146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9673876U Pending JPS5314470U (ja) 1976-07-19 1976-07-19

Country Status (1)

Country Link
JP (1) JPS5314470U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946612U (ja) * 1982-09-21 1984-03-28 柴田　宏己 旋回切削機
JPH0452761U (ja) * 1990-09-12 1992-05-06

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4829383A (ja) * 1971-08-18 1973-04-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4829383A (ja) * 1971-08-18 1973-04-18

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946612U (ja) * 1982-09-21 1984-03-28 柴田　宏己 旋回切削機
JPS6234651Y2 (ja) * 1982-09-21 1987-09-03
JPH0452761U (ja) * 1990-09-12 1992-05-06

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