JPS53143563U - - Google Patents
Info
- Publication number
- JPS53143563U JPS53143563U JP1977049208U JP4920877U JPS53143563U JP S53143563 U JPS53143563 U JP S53143563U JP 1977049208 U JP1977049208 U JP 1977049208U JP 4920877 U JP4920877 U JP 4920877U JP S53143563 U JPS53143563 U JP S53143563U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977049208U JPS5852689Y2 (ja) | 1977-04-18 | 1977-04-18 | 半導体装置用金属支持体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977049208U JPS5852689Y2 (ja) | 1977-04-18 | 1977-04-18 | 半導体装置用金属支持体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53143563U true JPS53143563U (https=) | 1978-11-13 |
| JPS5852689Y2 JPS5852689Y2 (ja) | 1983-12-01 |
Family
ID=28934369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977049208U Expired JPS5852689Y2 (ja) | 1977-04-18 | 1977-04-18 | 半導体装置用金属支持体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5852689Y2 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS513739U (https=) * | 1974-06-25 | 1976-01-12 | ||
| JPS51121171A (en) * | 1975-03-31 | 1976-10-22 | Western Electric Co | Magnetic reed contact |
-
1977
- 1977-04-18 JP JP1977049208U patent/JPS5852689Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS513739U (https=) * | 1974-06-25 | 1976-01-12 | ||
| JPS51121171A (en) * | 1975-03-31 | 1976-10-22 | Western Electric Co | Magnetic reed contact |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5852689Y2 (ja) | 1983-12-01 |