JPS53139285U - - Google Patents

Info

Publication number
JPS53139285U
JPS53139285U JP1977043634U JP4363477U JPS53139285U JP S53139285 U JPS53139285 U JP S53139285U JP 1977043634 U JP1977043634 U JP 1977043634U JP 4363477 U JP4363477 U JP 4363477U JP S53139285 U JPS53139285 U JP S53139285U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1977043634U
Other languages
Japanese (ja)
Other versions
JPS5732608Y2 (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977043634U priority Critical patent/JPS5732608Y2/ja
Publication of JPS53139285U publication Critical patent/JPS53139285U/ja
Application granted granted Critical
Publication of JPS5732608Y2 publication Critical patent/JPS5732608Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP1977043634U 1977-04-07 1977-04-07 Expired JPS5732608Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977043634U JPS5732608Y2 (en:Method) 1977-04-07 1977-04-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977043634U JPS5732608Y2 (en:Method) 1977-04-07 1977-04-07

Publications (2)

Publication Number Publication Date
JPS53139285U true JPS53139285U (en:Method) 1978-11-04
JPS5732608Y2 JPS5732608Y2 (en:Method) 1982-07-17

Family

ID=28918427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977043634U Expired JPS5732608Y2 (en:Method) 1977-04-07 1977-04-07

Country Status (1)

Country Link
JP (1) JPS5732608Y2 (en:Method)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48112276U (en:Method) * 1972-03-28 1973-12-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48112276U (en:Method) * 1972-03-28 1973-12-22

Also Published As

Publication number Publication date
JPS5732608Y2 (en:Method) 1982-07-17

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