JPS53133512A - Mount material for diamond die - Google Patents

Mount material for diamond die

Info

Publication number
JPS53133512A
JPS53133512A JP4891977A JP4891977A JPS53133512A JP S53133512 A JPS53133512 A JP S53133512A JP 4891977 A JP4891977 A JP 4891977A JP 4891977 A JP4891977 A JP 4891977A JP S53133512 A JPS53133512 A JP S53133512A
Authority
JP
Japan
Prior art keywords
mount material
diamond die
diamond
die
mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4891977A
Other languages
Japanese (ja)
Other versions
JPS5812082B2 (en
Inventor
Akio Hara
Shuji Yatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP4891977A priority Critical patent/JPS5812082B2/en
Publication of JPS53133512A publication Critical patent/JPS53133512A/en
Publication of JPS5812082B2 publication Critical patent/JPS5812082B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Metal Extraction Processes (AREA)

Abstract

PURPOSE:The developement of the mount material for diamond die having excellent rigidity, which is obtained by using the granular superhard alloy and silver solder, copper solder, etc. as the reinforcing materials.
JP4891977A 1977-04-26 1977-04-26 Diamond die mounting material Expired JPS5812082B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4891977A JPS5812082B2 (en) 1977-04-26 1977-04-26 Diamond die mounting material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4891977A JPS5812082B2 (en) 1977-04-26 1977-04-26 Diamond die mounting material

Publications (2)

Publication Number Publication Date
JPS53133512A true JPS53133512A (en) 1978-11-21
JPS5812082B2 JPS5812082B2 (en) 1983-03-07

Family

ID=12816648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4891977A Expired JPS5812082B2 (en) 1977-04-26 1977-04-26 Diamond die mounting material

Country Status (1)

Country Link
JP (1) JPS5812082B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61138411U (en) * 1985-02-19 1986-08-28
US4932582A (en) * 1988-06-24 1990-06-12 Asahi Diamond Industrial Co., Ltd. Method for the preparation of a bonding tool

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0572691U (en) * 1992-01-17 1993-10-05 株式会社丹下 Hawk in front of a bicycle

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61138411U (en) * 1985-02-19 1986-08-28
US4932582A (en) * 1988-06-24 1990-06-12 Asahi Diamond Industrial Co., Ltd. Method for the preparation of a bonding tool

Also Published As

Publication number Publication date
JPS5812082B2 (en) 1983-03-07

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