JPS5313247U - - Google Patents
Info
- Publication number
- JPS5313247U JPS5313247U JP1976094520U JP9452076U JPS5313247U JP S5313247 U JPS5313247 U JP S5313247U JP 1976094520 U JP1976094520 U JP 1976094520U JP 9452076 U JP9452076 U JP 9452076U JP S5313247 U JPS5313247 U JP S5313247U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976094520U JPS5313247U (en) | 1976-07-16 | 1976-07-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976094520U JPS5313247U (en) | 1976-07-16 | 1976-07-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5313247U true JPS5313247U (en) | 1978-02-03 |
Family
ID=28705048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976094520U Pending JPS5313247U (en) | 1976-07-16 | 1976-07-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5313247U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5776775A (en) * | 1980-10-30 | 1982-05-13 | Suwa Seikosha Kk | Method of soldering lead wire |
-
1976
- 1976-07-16 JP JP1976094520U patent/JPS5313247U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5776775A (en) * | 1980-10-30 | 1982-05-13 | Suwa Seikosha Kk | Method of soldering lead wire |