JPS5313078U - - Google Patents
Info
- Publication number
- JPS5313078U JPS5313078U JP1976093934U JP9393476U JPS5313078U JP S5313078 U JPS5313078 U JP S5313078U JP 1976093934 U JP1976093934 U JP 1976093934U JP 9393476 U JP9393476 U JP 9393476U JP S5313078 U JPS5313078 U JP S5313078U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976093934U JPS5313078U (enExample) | 1976-07-14 | 1976-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976093934U JPS5313078U (enExample) | 1976-07-14 | 1976-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5313078U true JPS5313078U (enExample) | 1978-02-03 |
Family
ID=28704509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976093934U Pending JPS5313078U (enExample) | 1976-07-14 | 1976-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5313078U (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS495597A (enExample) * | 1972-05-05 | 1974-01-18 |
-
1976
- 1976-07-14 JP JP1976093934U patent/JPS5313078U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS495597A (enExample) * | 1972-05-05 | 1974-01-18 |