JPS531250U - - Google Patents

Info

Publication number
JPS531250U
JPS531250U JP13996776U JP13996776U JPS531250U JP S531250 U JPS531250 U JP S531250U JP 13996776 U JP13996776 U JP 13996776U JP 13996776 U JP13996776 U JP 13996776U JP S531250 U JPS531250 U JP S531250U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13996776U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13996776U priority Critical patent/JPS531250U/ja
Publication of JPS531250U publication Critical patent/JPS531250U/ja
Pending legal-status Critical Current

Links

JP13996776U 1976-10-18 1976-10-18 Pending JPS531250U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13996776U JPS531250U (en) 1976-10-18 1976-10-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13996776U JPS531250U (en) 1976-10-18 1976-10-18

Publications (1)

Publication Number Publication Date
JPS531250U true JPS531250U (en) 1978-01-09

Family

ID=28619813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13996776U Pending JPS531250U (en) 1976-10-18 1976-10-18

Country Status (1)

Country Link
JP (1) JPS531250U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1101598C (en) * 1997-03-24 2003-02-12 精工爱普生株式会社 Substrate for semiconductor device, lead frame, semiconductor device and method for manufacturing the same, circuit board and electronic equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5026264A (en) * 1973-07-11 1975-03-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5026264A (en) * 1973-07-11 1975-03-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1101598C (en) * 1997-03-24 2003-02-12 精工爱普生株式会社 Substrate for semiconductor device, lead frame, semiconductor device and method for manufacturing the same, circuit board and electronic equipment

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