JPS531250U - - Google Patents
Info
- Publication number
- JPS531250U JPS531250U JP13996776U JP13996776U JPS531250U JP S531250 U JPS531250 U JP S531250U JP 13996776 U JP13996776 U JP 13996776U JP 13996776 U JP13996776 U JP 13996776U JP S531250 U JPS531250 U JP S531250U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13996776U JPS531250U (en) | 1976-10-18 | 1976-10-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13996776U JPS531250U (en) | 1976-10-18 | 1976-10-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS531250U true JPS531250U (en) | 1978-01-09 |
Family
ID=28619813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13996776U Pending JPS531250U (en) | 1976-10-18 | 1976-10-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS531250U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1101598C (en) * | 1997-03-24 | 2003-02-12 | 精工爱普生株式会社 | Substrate for semiconductor device, lead frame, semiconductor device and method for manufacturing the same, circuit board and electronic equipment |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5026264A (en) * | 1973-07-11 | 1975-03-19 |
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1976
- 1976-10-18 JP JP13996776U patent/JPS531250U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5026264A (en) * | 1973-07-11 | 1975-03-19 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1101598C (en) * | 1997-03-24 | 2003-02-12 | 精工爱普生株式会社 | Substrate for semiconductor device, lead frame, semiconductor device and method for manufacturing the same, circuit board and electronic equipment |