JPS53124658U - - Google Patents
Info
- Publication number
- JPS53124658U JPS53124658U JP1977030239U JP3023977U JPS53124658U JP S53124658 U JPS53124658 U JP S53124658U JP 1977030239 U JP1977030239 U JP 1977030239U JP 3023977 U JP3023977 U JP 3023977U JP S53124658 U JPS53124658 U JP S53124658U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48092—Helix
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977030239U JPS53124658U (enrdf_load_stackoverflow) | 1977-03-12 | 1977-03-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977030239U JPS53124658U (enrdf_load_stackoverflow) | 1977-03-12 | 1977-03-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53124658U true JPS53124658U (enrdf_load_stackoverflow) | 1978-10-04 |
Family
ID=28879519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1977030239U Pending JPS53124658U (enrdf_load_stackoverflow) | 1977-03-12 | 1977-03-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53124658U (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6195574A (ja) * | 1984-10-17 | 1986-05-14 | Oputosu:Kk | 光半導体素子を含む組立体 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5040276B1 (enrdf_load_stackoverflow) * | 1971-07-29 | 1975-12-23 | ||
JPS5313351U (enrdf_load_stackoverflow) * | 1976-07-16 | 1978-02-03 |
-
1977
- 1977-03-12 JP JP1977030239U patent/JPS53124658U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5040276B1 (enrdf_load_stackoverflow) * | 1971-07-29 | 1975-12-23 | ||
JPS5313351U (enrdf_load_stackoverflow) * | 1976-07-16 | 1978-02-03 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6195574A (ja) * | 1984-10-17 | 1986-05-14 | Oputosu:Kk | 光半導体素子を含む組立体 |