JPS53124657U - - Google Patents

Info

Publication number
JPS53124657U
JPS53124657U JP1977030238U JP3023877U JPS53124657U JP S53124657 U JPS53124657 U JP S53124657U JP 1977030238 U JP1977030238 U JP 1977030238U JP 3023877 U JP3023877 U JP 3023877U JP S53124657 U JPS53124657 U JP S53124657U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1977030238U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977030238U priority Critical patent/JPS53124657U/ja
Publication of JPS53124657U publication Critical patent/JPS53124657U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48092Helix

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1977030238U 1977-03-12 1977-03-12 Pending JPS53124657U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977030238U JPS53124657U (enrdf_load_stackoverflow) 1977-03-12 1977-03-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977030238U JPS53124657U (enrdf_load_stackoverflow) 1977-03-12 1977-03-12

Publications (1)

Publication Number Publication Date
JPS53124657U true JPS53124657U (enrdf_load_stackoverflow) 1978-10-04

Family

ID=28879516

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977030238U Pending JPS53124657U (enrdf_load_stackoverflow) 1977-03-12 1977-03-12

Country Status (1)

Country Link
JP (1) JPS53124657U (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4975081A (enrdf_load_stackoverflow) * 1972-11-22 1974-07-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4975081A (enrdf_load_stackoverflow) * 1972-11-22 1974-07-19

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