JPS53124647U - - Google Patents
Info
- Publication number
- JPS53124647U JPS53124647U JP1977029601U JP2960177U JPS53124647U JP S53124647 U JPS53124647 U JP S53124647U JP 1977029601 U JP1977029601 U JP 1977029601U JP 2960177 U JP2960177 U JP 2960177U JP S53124647 U JPS53124647 U JP S53124647U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/884—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977029601U JPS575879Y2 (esLanguage) | 1977-03-14 | 1977-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977029601U JPS575879Y2 (esLanguage) | 1977-03-14 | 1977-03-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53124647U true JPS53124647U (esLanguage) | 1978-10-04 |
| JPS575879Y2 JPS575879Y2 (esLanguage) | 1982-02-03 |
Family
ID=28877676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977029601U Expired JPS575879Y2 (esLanguage) | 1977-03-14 | 1977-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS575879Y2 (esLanguage) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023223616A1 (ja) * | 2022-05-17 | 2023-11-23 | 株式会社日立パワーデバイス | 半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4951872A (esLanguage) * | 1972-06-13 | 1974-05-20 |
-
1977
- 1977-03-14 JP JP1977029601U patent/JPS575879Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4951872A (esLanguage) * | 1972-06-13 | 1974-05-20 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023223616A1 (ja) * | 2022-05-17 | 2023-11-23 | 株式会社日立パワーデバイス | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS575879Y2 (esLanguage) | 1982-02-03 |