JPS53124647U - - Google Patents

Info

Publication number
JPS53124647U
JPS53124647U JP2960177U JP2960177U JPS53124647U JP S53124647 U JPS53124647 U JP S53124647U JP 2960177 U JP2960177 U JP 2960177U JP 2960177 U JP2960177 U JP 2960177U JP S53124647 U JPS53124647 U JP S53124647U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2960177U
Other languages
Japanese (ja)
Other versions
JPS575879Y2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977029601U priority Critical patent/JPS575879Y2/ja
Publication of JPS53124647U publication Critical patent/JPS53124647U/ja
Application granted granted Critical
Publication of JPS575879Y2 publication Critical patent/JPS575879Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Die Bonding (AREA)
JP1977029601U 1977-03-14 1977-03-14 Expired JPS575879Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977029601U JPS575879Y2 (enrdf_load_html_response) 1977-03-14 1977-03-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977029601U JPS575879Y2 (enrdf_load_html_response) 1977-03-14 1977-03-14

Publications (2)

Publication Number Publication Date
JPS53124647U true JPS53124647U (enrdf_load_html_response) 1978-10-04
JPS575879Y2 JPS575879Y2 (enrdf_load_html_response) 1982-02-03

Family

ID=28877676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977029601U Expired JPS575879Y2 (enrdf_load_html_response) 1977-03-14 1977-03-14

Country Status (1)

Country Link
JP (1) JPS575879Y2 (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023223616A1 (ja) * 2022-05-17 2023-11-23 株式会社日立パワーデバイス 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4951872A (enrdf_load_html_response) * 1972-06-13 1974-05-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4951872A (enrdf_load_html_response) * 1972-06-13 1974-05-20

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023223616A1 (ja) * 2022-05-17 2023-11-23 株式会社日立パワーデバイス 半導体装置

Also Published As

Publication number Publication date
JPS575879Y2 (enrdf_load_html_response) 1982-02-03

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