JPS53120967U - - Google Patents

Info

Publication number
JPS53120967U
JPS53120967U JP1977026054U JP2605477U JPS53120967U JP S53120967 U JPS53120967 U JP S53120967U JP 1977026054 U JP1977026054 U JP 1977026054U JP 2605477 U JP2605477 U JP 2605477U JP S53120967 U JPS53120967 U JP S53120967U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1977026054U
Other languages
Japanese (ja)
Other versions
JPS578206Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977026054U priority Critical patent/JPS578206Y2/ja
Publication of JPS53120967U publication Critical patent/JPS53120967U/ja
Application granted granted Critical
Publication of JPS578206Y2 publication Critical patent/JPS578206Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
JP1977026054U 1977-03-04 1977-03-04 Expired JPS578206Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977026054U JPS578206Y2 (enExample) 1977-03-04 1977-03-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977026054U JPS578206Y2 (enExample) 1977-03-04 1977-03-04

Publications (2)

Publication Number Publication Date
JPS53120967U true JPS53120967U (enExample) 1978-09-26
JPS578206Y2 JPS578206Y2 (enExample) 1982-02-17

Family

ID=28867585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977026054U Expired JPS578206Y2 (enExample) 1977-03-04 1977-03-04

Country Status (1)

Country Link
JP (1) JPS578206Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5330919A (en) * 1976-07-19 1978-03-23 Amax Inc Method of separating cobalt from nickel solution by ozone decomposition

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49135589A (enExample) * 1973-04-27 1974-12-27
JPS5029284A (enExample) * 1973-07-11 1975-03-25
JPS5152308U (enExample) * 1974-10-21 1976-04-21

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49135589A (enExample) * 1973-04-27 1974-12-27
JPS5029284A (enExample) * 1973-07-11 1975-03-25
JPS5152308U (enExample) * 1974-10-21 1976-04-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5330919A (en) * 1976-07-19 1978-03-23 Amax Inc Method of separating cobalt from nickel solution by ozone decomposition

Also Published As

Publication number Publication date
JPS578206Y2 (enExample) 1982-02-17

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