JPS53118478A - Resin molded products, their manufacture, and molding tool for it - Google Patents

Resin molded products, their manufacture, and molding tool for it

Info

Publication number
JPS53118478A
JPS53118478A JP3219577A JP3219577A JPS53118478A JP S53118478 A JPS53118478 A JP S53118478A JP 3219577 A JP3219577 A JP 3219577A JP 3219577 A JP3219577 A JP 3219577A JP S53118478 A JPS53118478 A JP S53118478A
Authority
JP
Japan
Prior art keywords
molding tool
manufacture
resin molded
molded products
molded article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3219577A
Other languages
Japanese (ja)
Inventor
Takeshi Shimizu
Keizo Otsuki
Hidetoshi Mochizuki
Hisashi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3219577A priority Critical patent/JPS53118478A/en
Publication of JPS53118478A publication Critical patent/JPS53118478A/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To decrease the ratio of the resin flow velocity on top of the molded article to that of the surrounding resin and to prevent the formation of air bubbles or pinholes inside or on the surface of the molded article, by the use of a molding tool having partial unevenness on the inner wall.
JP3219577A 1977-03-25 1977-03-25 Resin molded products, their manufacture, and molding tool for it Pending JPS53118478A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3219577A JPS53118478A (en) 1977-03-25 1977-03-25 Resin molded products, their manufacture, and molding tool for it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3219577A JPS53118478A (en) 1977-03-25 1977-03-25 Resin molded products, their manufacture, and molding tool for it

Related Child Applications (4)

Application Number Title Priority Date Filing Date
JP15332583A Division JPS5980952A (en) 1983-08-24 1983-08-24 Resin molded electronic component parts
JP15332483A Division JPS5980951A (en) 1983-08-24 1983-08-24 Resin molded electronic component parts
JP15332383A Division JPS5981126A (en) 1983-08-24 1983-08-24 Manufacture of resin mold product
JP15332283A Division JPS5981125A (en) 1983-08-24 1983-08-24 Forces for resin molding

Publications (1)

Publication Number Publication Date
JPS53118478A true JPS53118478A (en) 1978-10-16

Family

ID=12352112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3219577A Pending JPS53118478A (en) 1977-03-25 1977-03-25 Resin molded products, their manufacture, and molding tool for it

Country Status (1)

Country Link
JP (1) JPS53118478A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60175434A (en) * 1984-02-21 1985-09-09 Sanyo Electric Co Ltd Manufacture of resin-sealed semiconductor device
JPS60180127A (en) * 1984-02-27 1985-09-13 Sanyo Electric Co Ltd Manufacture of resin sealed type semiconductor device
JPS6167943A (en) * 1984-09-12 1986-04-08 Hitachi Ltd Insulation-type semiconductor device and mold for manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5050883A (en) * 1973-09-05 1975-05-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5050883A (en) * 1973-09-05 1975-05-07

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60175434A (en) * 1984-02-21 1985-09-09 Sanyo Electric Co Ltd Manufacture of resin-sealed semiconductor device
JPH0234456B2 (en) * 1984-02-21 1990-08-03 Sanyo Electric Co
JPS60180127A (en) * 1984-02-27 1985-09-13 Sanyo Electric Co Ltd Manufacture of resin sealed type semiconductor device
JPH0234457B2 (en) * 1984-02-27 1990-08-03 Sanyo Electric Co
JPS6167943A (en) * 1984-09-12 1986-04-08 Hitachi Ltd Insulation-type semiconductor device and mold for manufacturing the same

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