JPS53118470U - - Google Patents

Info

Publication number
JPS53118470U
JPS53118470U JP1977023620U JP2362077U JPS53118470U JP S53118470 U JPS53118470 U JP S53118470U JP 1977023620 U JP1977023620 U JP 1977023620U JP 2362077 U JP2362077 U JP 2362077U JP S53118470 U JPS53118470 U JP S53118470U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1977023620U
Other versions
JPS5643012Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977023620U priority Critical patent/JPS5643012Y2/ja
Publication of JPS53118470U publication Critical patent/JPS53118470U/ja
Application granted granted Critical
Publication of JPS5643012Y2 publication Critical patent/JPS5643012Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1977023620U 1977-02-28 1977-02-28 Expired JPS5643012Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977023620U JPS5643012Y2 (ja) 1977-02-28 1977-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977023620U JPS5643012Y2 (ja) 1977-02-28 1977-02-28

Publications (2)

Publication Number Publication Date
JPS53118470U true JPS53118470U (ja) 1978-09-20
JPS5643012Y2 JPS5643012Y2 (ja) 1981-10-08

Family

ID=28860562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977023620U Expired JPS5643012Y2 (ja) 1977-02-28 1977-02-28

Country Status (1)

Country Link
JP (1) JPS5643012Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61251120A (ja) * 1985-04-30 1986-11-08 Sumitomo Electric Ind Ltd 化合物半導体基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61251120A (ja) * 1985-04-30 1986-11-08 Sumitomo Electric Ind Ltd 化合物半導体基板

Also Published As

Publication number Publication date
JPS5643012Y2 (ja) 1981-10-08

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