JPS53117010A - Method of cutting glass - Google Patents
Method of cutting glassInfo
- Publication number
- JPS53117010A JPS53117010A JP3248577A JP3248577A JPS53117010A JP S53117010 A JPS53117010 A JP S53117010A JP 3248577 A JP3248577 A JP 3248577A JP 3248577 A JP3248577 A JP 3248577A JP S53117010 A JPS53117010 A JP S53117010A
- Authority
- JP
- Japan
- Prior art keywords
- cutting glass
- cutting
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52032485A JPS5915088B2 (en) | 1977-03-23 | 1977-03-23 | How to cut glass |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52032485A JPS5915088B2 (en) | 1977-03-23 | 1977-03-23 | How to cut glass |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53117010A true JPS53117010A (en) | 1978-10-13 |
JPS5915088B2 JPS5915088B2 (en) | 1984-04-07 |
Family
ID=12360276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52032485A Expired JPS5915088B2 (en) | 1977-03-23 | 1977-03-23 | How to cut glass |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5915088B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01215736A (en) * | 1988-02-20 | 1989-08-29 | Semiconductor Energy Lab Co Ltd | Cutting of thin glass plate |
JP2007062074A (en) * | 2005-08-30 | 2007-03-15 | Seiko Epson Corp | Display panel, laser scribing method of display panel and electronic device |
JP2007238438A (en) * | 2007-05-01 | 2007-09-20 | Seiko Epson Corp | Laser cutting method, method for manufacturing electrooptical device, electrooptical device, electronics device, and laser cutting device |
JP2008000756A (en) * | 2006-06-20 | 2008-01-10 | Seiko Epson Corp | Substrate, method for parting the same, electrooptical device, method for producing the same and electronic equipment |
-
1977
- 1977-03-23 JP JP52032485A patent/JPS5915088B2/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01215736A (en) * | 1988-02-20 | 1989-08-29 | Semiconductor Energy Lab Co Ltd | Cutting of thin glass plate |
JP2007062074A (en) * | 2005-08-30 | 2007-03-15 | Seiko Epson Corp | Display panel, laser scribing method of display panel and electronic device |
JP4742751B2 (en) * | 2005-08-30 | 2011-08-10 | セイコーエプソン株式会社 | Display panel, laser scribing method for display panel, and electronic device |
JP2008000756A (en) * | 2006-06-20 | 2008-01-10 | Seiko Epson Corp | Substrate, method for parting the same, electrooptical device, method for producing the same and electronic equipment |
JP4706570B2 (en) * | 2006-06-20 | 2011-06-22 | セイコーエプソン株式会社 | Substrate and method for dividing the same, electro-optical device and method for manufacturing the same, and electronic apparatus |
JP2007238438A (en) * | 2007-05-01 | 2007-09-20 | Seiko Epson Corp | Laser cutting method, method for manufacturing electrooptical device, electrooptical device, electronics device, and laser cutting device |
Also Published As
Publication number | Publication date |
---|---|
JPS5915088B2 (en) | 1984-04-07 |
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