JPS53108882U - - Google Patents
Info
- Publication number
- JPS53108882U JPS53108882U JP1977014709U JP1470977U JPS53108882U JP S53108882 U JPS53108882 U JP S53108882U JP 1977014709 U JP1977014709 U JP 1977014709U JP 1470977 U JP1470977 U JP 1470977U JP S53108882 U JPS53108882 U JP S53108882U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977014709U JPS53108882U (enExample) | 1977-02-08 | 1977-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977014709U JPS53108882U (enExample) | 1977-02-08 | 1977-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS53108882U true JPS53108882U (enExample) | 1978-08-31 |
Family
ID=28835107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977014709U Pending JPS53108882U (enExample) | 1977-02-08 | 1977-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53108882U (enExample) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3914786A (en) * | 1974-04-19 | 1975-10-21 | Hewlett Packard Co | In-line reflective lead-pair for light-emitting diodes |
| JPS50153590A (enExample) * | 1974-05-29 | 1975-12-10 | ||
| JPS5329090A (en) * | 1976-08-31 | 1978-03-17 | Oki Electric Ind Co Ltd | Semiconductor photo coupler |
-
1977
- 1977-02-08 JP JP1977014709U patent/JPS53108882U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3914786A (en) * | 1974-04-19 | 1975-10-21 | Hewlett Packard Co | In-line reflective lead-pair for light-emitting diodes |
| JPS50153590A (enExample) * | 1974-05-29 | 1975-12-10 | ||
| JPS5329090A (en) * | 1976-08-31 | 1978-03-17 | Oki Electric Ind Co Ltd | Semiconductor photo coupler |