JPS53108871U - - Google Patents
Info
- Publication number
- JPS53108871U JPS53108871U JP1470277U JP1470277U JPS53108871U JP S53108871 U JPS53108871 U JP S53108871U JP 1470277 U JP1470277 U JP 1470277U JP 1470277 U JP1470277 U JP 1470277U JP S53108871 U JPS53108871 U JP S53108871U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1470277U JPS53108871U (en) | 1977-02-08 | 1977-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1470277U JPS53108871U (en) | 1977-02-08 | 1977-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS53108871U true JPS53108871U (en) | 1978-08-31 |
Family
ID=28835086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1470277U Pending JPS53108871U (en) | 1977-02-08 | 1977-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53108871U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8169128B2 (en) | 2005-08-08 | 2012-05-01 | Samsung Led Co., Ltd. | LED package having recess in heat conducting part |
-
1977
- 1977-02-08 JP JP1470277U patent/JPS53108871U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8169128B2 (en) | 2005-08-08 | 2012-05-01 | Samsung Led Co., Ltd. | LED package having recess in heat conducting part |