JPS5310835B2 - - Google Patents

Info

Publication number
JPS5310835B2
JPS5310835B2 JP7810971A JP7810971A JPS5310835B2 JP S5310835 B2 JPS5310835 B2 JP S5310835B2 JP 7810971 A JP7810971 A JP 7810971A JP 7810971 A JP7810971 A JP 7810971A JP S5310835 B2 JPS5310835 B2 JP S5310835B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7810971A
Other languages
Japanese (ja)
Other versions
JPS4843586A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7810971A priority Critical patent/JPS5310835B2/ja
Publication of JPS4843586A publication Critical patent/JPS4843586A/ja
Publication of JPS5310835B2 publication Critical patent/JPS5310835B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Die Bonding (AREA)
JP7810971A 1971-10-05 1971-10-05 Expired JPS5310835B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7810971A JPS5310835B2 (enrdf_load_stackoverflow) 1971-10-05 1971-10-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7810971A JPS5310835B2 (enrdf_load_stackoverflow) 1971-10-05 1971-10-05

Publications (2)

Publication Number Publication Date
JPS4843586A JPS4843586A (enrdf_load_stackoverflow) 1973-06-23
JPS5310835B2 true JPS5310835B2 (enrdf_load_stackoverflow) 1978-04-17

Family

ID=13652706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7810971A Expired JPS5310835B2 (enrdf_load_stackoverflow) 1971-10-05 1971-10-05

Country Status (1)

Country Link
JP (1) JPS5310835B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552683Y2 (enrdf_load_stackoverflow) * 1976-03-30 1980-12-06
JPS5341545A (en) * 1976-05-25 1978-04-15 Kanebo Ltd Method and device for humidifying wound yarn
JPS5683958A (en) * 1979-12-12 1981-07-08 Fujitsu Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS4843586A (enrdf_load_stackoverflow) 1973-06-23

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