JPS5310835B2 - - Google Patents

Info

Publication number
JPS5310835B2
JPS5310835B2 JP7810971A JP7810971A JPS5310835B2 JP S5310835 B2 JPS5310835 B2 JP S5310835B2 JP 7810971 A JP7810971 A JP 7810971A JP 7810971 A JP7810971 A JP 7810971A JP S5310835 B2 JPS5310835 B2 JP S5310835B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7810971A
Other languages
Japanese (ja)
Other versions
JPS4843586A (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7810971A priority Critical patent/JPS5310835B2/ja
Publication of JPS4843586A publication Critical patent/JPS4843586A/ja
Publication of JPS5310835B2 publication Critical patent/JPS5310835B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909Post-treatment of the connector or wire bonding area
    • H01L2224/8592Applying permanent coating, e.g. protective coating

Landscapes

  • Die Bonding (AREA)
JP7810971A 1971-10-05 1971-10-05 Expired JPS5310835B2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7810971A JPS5310835B2 (cs) 1971-10-05 1971-10-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7810971A JPS5310835B2 (cs) 1971-10-05 1971-10-05

Publications (2)

Publication Number Publication Date
JPS4843586A JPS4843586A (cs) 1973-06-23
JPS5310835B2 true JPS5310835B2 (cs) 1978-04-17

Family

ID=13652706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7810971A Expired JPS5310835B2 (cs) 1971-10-05 1971-10-05

Country Status (1)

Country Link
JP (1) JPS5310835B2 (cs)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552683Y2 (cs) * 1976-03-30 1980-12-06
JPS5341545A (en) * 1976-05-25 1978-04-15 Kanebo Ltd Method and device for humidifying wound yarn
JPS5683958A (en) * 1979-12-12 1981-07-08 Fujitsu Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS4843586A (cs) 1973-06-23

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