JPS5310662B2 - - Google Patents
Info
- Publication number
- JPS5310662B2 JPS5310662B2 JP11127072A JP11127072A JPS5310662B2 JP S5310662 B2 JPS5310662 B2 JP S5310662B2 JP 11127072 A JP11127072 A JP 11127072A JP 11127072 A JP11127072 A JP 11127072A JP S5310662 B2 JPS5310662 B2 JP S5310662B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11127072A JPS5310662B2 (US20080094685A1-20080424-C00004.png) | 1972-11-08 | 1972-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11127072A JPS5310662B2 (US20080094685A1-20080424-C00004.png) | 1972-11-08 | 1972-11-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4968262A JPS4968262A (US20080094685A1-20080424-C00004.png) | 1974-07-02 |
| JPS5310662B2 true JPS5310662B2 (US20080094685A1-20080424-C00004.png) | 1978-04-15 |
Family
ID=14556941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11127072A Expired JPS5310662B2 (US20080094685A1-20080424-C00004.png) | 1972-11-08 | 1972-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5310662B2 (US20080094685A1-20080424-C00004.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017076698A (ja) * | 2015-10-15 | 2017-04-20 | 日本特殊陶業株式会社 | 配線基板およびその製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5498963A (en) * | 1978-01-20 | 1979-08-04 | Tokyo Shibaura Electric Co | Thick film circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3700443A (en) * | 1971-04-01 | 1972-10-24 | Litton Systems Inc | Flatpack lead positioning device |
-
1972
- 1972-11-08 JP JP11127072A patent/JPS5310662B2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3700443A (en) * | 1971-04-01 | 1972-10-24 | Litton Systems Inc | Flatpack lead positioning device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017076698A (ja) * | 2015-10-15 | 2017-04-20 | 日本特殊陶業株式会社 | 配線基板およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4968262A (US20080094685A1-20080424-C00004.png) | 1974-07-02 |
